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1

[IEEE 2014 IEEE Aerospace Conference - Big Sky, MT, USA (2014.3.1-2014.3.8)] 2014 IEEE Aerospace Conference - Next generation rope-like robot for in-space inspection

Tonapi, Manas M., Godage, Isuru S., Walker, Ian D.

Year:

2014

Language:

english

File:

PDF, 2.67 MB

english, 2014

2

Hierarchical field compositions for simulations of near-percolation thermal transport in particulate materials

S. Kanuparthi, M. Rayasam, G. Subbarayan, B. Sammakia, A. Gowda, S. Tonapi

Journal:

Computer Methods in Applied Mechanics and Engineering

Year:

2009

Language:

english

File:

PDF, 846 KB

english, 2009

3

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Spherical Boron Nitride Fillers For High Performance Thermal Greases

Gowda, A., Paisner, S.N., Tonapi, S., Meneghetti, P., Hans, P., Strosaker, G., Acharya, A., Nagarkar, K., Srihari, K.

Year:

2005

Language:

english

File:

PDF, 4.87 MB

english, 2005

4

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Gowda, Arun, Esler, David, Tonapi, Sandeep, Zhong, Annita, Srihari, K., Schattenmann, Florian

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 1.21 MB

english, 2006

5

[IEEE 2014 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2014) - Chicago, IL, USA (2014.9.14-2014.9.18)] 2014 IEEE/RSJ International Conference on Intelligent Robots and Systems - Design, modeling and performance evaluation of a long and slim continuum robotic cable

Tonapi, Manas M., Godage, Isuru S., Walker, Ian D.

Year:

2014

Language:

english

File:

PDF, 349 KB

english, 2014

6

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Gowda, Arun, Zhong, Annita, Tonapi, Sandeep, Nagarkar, Kaustubh, Srihari, K.

Year:

2005

Language:

english

File:

PDF, 440 KB

english, 2005

7

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 - Design for Reliability of Stacked Die Package Using TSV Technology

Thakur, Shiwani, Nakanekar, Satej, Kaisare, Abhijit, Tonapi, Sandeep

Year:

2011

Language:

english

File:

PDF, 677 KB

english, 2011

8

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Mahalingam, Saketh, Prabhakumar, Ananth, Tonapi, Sandeep, Sitaraman, Suresh K.

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 496 KB

english, 2008

9

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Rubinsztajn, Slawomir, Buckley, Donald, Campbell, John, Esler, David, Fiveland, Eric, Prabhakumar, Ananth, Sherman, Donna, Tonapi, Sandeep

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 1.34 MB

english, 2005

10

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Mahalingam, Saketh, Goray, Kunal, Tonapi, Sandeep, Sitaraman, Suresh K.

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 538 KB

english, 2006

11

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages

Mahalingam, Saketh, Tonapi, Sandeep, Sitaraman, Suresh K.

Year:

2005

Language:

english

File:

PDF, 495 KB

english, 2005

12

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Hierarchical Modeling and Trade-Off Studies in Design of Thermal Interface Materials

Zhang, X., Kanuparthi, S., Subbarayan, G., Sammakia, B., Tonapi, S.

Year:

2005

Language:

english

File:

PDF, 330 KB

english, 2005

13

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Tonapi, Sandeep S., Sathe, Sanjeev B., Sammakia, Bahgat G., Srihari, K.

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 720 KB

english, 2006

14

Effect of temperature on the oxygen consumption in the larvae of dineutes indicus aube (gyrinidae, coleoptera)

G. T. Tonapi, H. N. Mohan Rao

Journal:

Year:

1977

Language:

english

File:

PDF, 233 KB

english, 1977

15

Prothoracic tracheae of a Buprestid beetle

Journal:

Naturwissenschaften (The Science of Nature)

Year:

1968

File:

PDF, 573 KB

1968

16

Tumor Necrosis Factor Activity Increases in the Early Response to Trauma

Kevin L. Ferguson, Paul Taheri, Jorge Rodriguez, Vijay Tonapi, Anthony Cardellio, Ron Dechert

Journal:

Academic Emergency Medicine

Year:

1997

Language:

english

File:

PDF, 575 KB

english, 1997

17

Effects of fumigants on the spiracles and the possible role of a neurohumor on the spiracular activity ofPeriplaneta americana(L.)

S. S. Bhatia, G. T. Tonapi

Journal:

Cellular and Molecular Life Sciences

Year:

1968

File:

PDF, 270 KB

1968

18

The effect of fumigants on the physiology of respiration inPeriplaneta Americana(L)

Journal:

Proceedings: Plant Sciences

Year:

1971

Language:

english

File:

PDF, 2.04 MB

english, 1971

19

Some biophysical considerations of insect respiration

Journal:

Proceedings: Plant Sciences

Year:

1973

Language:

english

File:

PDF, 2.87 MB

english, 1973

20

A note on the respiratory system of the male ofDorylus labiatusShuck

Journal:

Proceedings: Plant Sciences

Year:

1959

Language:

english

File:

PDF, 1.03 MB

english, 1959

21

Notes on the freshwater fauna of Poona

G. T. Tonapi, Leela Mulherkar

Journal:

Proceedings: Plant Sciences

Year:

1963

Language:

english

File:

PDF, 1.44 MB

english, 1963

22

A COMPARATIVE STUDY OF SPIRACULAR STRUCTURE AND MECHANISMS IN SOME HYMENOPTERA

Journal:

Ecological Entomology

Year:

1958

Language:

english

File:

PDF, 3.55 MB

english, 1958

23

Some Adaptive Features in the Respiratory System of Dineutes indicus Aubé (Coleoptera, Gyrinidae)

GOPAL T. TONAPI

Journal:

Zoologica Scripta

Year:

1978

Language:

english

File:

PDF, 650 KB

english, 1978

24

Observations on the identity of some Indian freshwater turtles and their feeding habits

George Varghese, G.T. Tonapi

Journal:

Biological Conservation

Year:

1986

Language:

english

File:

PDF, 264 KB

english, 1986

25

Effect of tranquillizers on the heart of periplaneta americana(l.)

H.N.Mohan Rao, G.T. Tonapi

Journal:

Comparative and General Pharmacology

Year:

1971

Language:

english

File:

PDF, 370 KB

english, 1971

26

[IEEE Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. - San Jose, CA, USA (March 15-17, 2005)] Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. - Reliability testing of silicone-based thermal greases

Gowda, A., Esler, D., Paisner, S.N., Tonapi, S., Nagarkar, K., Srihari, K.

Year:

2005

Language:

english

File:

PDF, 1.64 MB

english, 2005

27

[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Comparison of the thermal performance of wire bonded and flip chip CSP's

Joshi, A., Tonapi, S., Burdick, W., Tkaczyk, E., Lacey, J.

Year:

2004

Language:

english

File:

PDF, 394 KB

english, 2004

28

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermo-mechanical analysis of a typical solar module: A parametric study

Thakur, Shiwani, Kaisare, Abhijit, Tonapi, Sandeep

Year:

2012

Language:

english

File:

PDF, 846 KB

english, 2012

29

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal characterization of solar module due to impact of solar heat flux as an effect of geographical topology

Trifale, Ninad, Kaisare, Abhijit, Tonapi, Sandeep

Year:

2012

Language:

english

File:

PDF, 1.43 MB

english, 2012

30

[IEEE 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Atlanta, GA, USA (15-17 March 2006)] 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Hierarchical Synthesis of Particulate Thermal Interface Materials

Kanuparthi, S., Zhang, X., Subbarayan, G., Sammakia, B., Gowda, A., Tonapi, S.

Year:

2006

Language:

english

File:

PDF, 649 KB

english, 2006

31

Utility of biocontrol agents in the suppression of seed borne pathogenic mycoflora and their effect on seed quality in sorghum ( Sorghum bicolor (L.) Moench)

Indira, S., Muthusubramanian, V., Tonapi, V. A., Varanavasiappan, S., Seetharama, N.

Journal:

Archives of Phytopathology and Plant Protection

Year:

2006

Language:

english

File:

PDF, 119 KB

english, 2006

32

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal characterization of the IGBT modules used in hybrid electric vehicles

Lambate, Harichandra, Nakanekar, Satej, Tonapi, Sandeep

Year:

2014

Language:

english

File:

PDF, 342 KB

english, 2014

33

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Reliability of flip chip on flexible substrates under drop impact

Mulla, Mohasin, Bonde, Kalpesh, Sabale, Mayur, Thakur, Shiwani, Tonapi, Sandeep

Year:

2014

Language:

english

File:

PDF, 1.55 MB

english, 2014

34

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - A parametric study of a typical high power LED package to enhance overall thermal performance

Vipradas, Aditya, Takawale, Anand, Tripathi, Sandeep, Swakul, Vinay, Kaisare, Abhijit, Tonapi, Sandeep

Year:

2012

Language:

english

File:

PDF, 436 KB

english, 2012

35

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal management of an IGBT module using two-phase cooling

Malu, Neha, Bora, Disha, Nakanekar, Satej, Tonapi, Sandeep

Year:

2014

Language:

english

File:

PDF, 420 KB

english, 2014

36

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Fatigue life prediction for solder interconnects in IGBT modules by using the successive initiation method

Ghodke, Nilesh, Kumbhakarna, Dipesh, Nakanekar, Satej, Tonapi, Sandeep

Year:

2014

Language:

english

File:

PDF, 554 KB

english, 2014

37

[IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Irvine, California, USA (March 16-18, 2005)] Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Utilization of carbon fibers in thermal management of microelectronics

Zhong, H.A., Rubinsztajn, S., Gowda, A., Esler, D., Gibson, D., Buckley, D., Osaheni, J., Tonapi, S.

Year:

2005

Language:

english

File:

PDF, 2.23 MB

english, 2005

38

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Parametric studies of the thermal performance of back-to-back tape ball grid array (TBGA) packages

Tonapi, S.S., Sathe, S.B., Sammakia, B.G., Srihari, K.

Year:

2001

Language:

english

File:

PDF, 772 KB

english, 2001

39

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of underfill design parameters on die cracking in flip chip on flexible substrates

Sabale, Mayur, Vinerkar, Kiran, Thakur, Shiwani, Tonapi, Sandeep

Year:

2014

Language:

english

File:

PDF, 534 KB

english, 2014

40

[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial Resistance

Kanuparthi, S., Zhang, X., Subbarayan, G., Sammakia, B., Gowda, A., Tonapi, S.

Year:

2006

Language:

english

File:

PDF, 447 KB

english, 2006

41

[IEEE IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop - Munich, Germany (31 March-1 April 2003)] Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI - An overview of thermal management for next generation microelectronic devices

Tonapi, S.S., Fillion, R.A., Schattenmann, F.J., Cole, H.S., Evans, J.D., Sammakia, B.G.

Year:

2003

Language:

english

File:

PDF, 376 KB

english, 2003

42

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Development of a novel filled no-flow underfill material for flip chip applications

Prabhakumar, A., Rubinsztajn, S., Buckley, D., Campbell, J., Sherman, D., Esler, D., Fiveland, E., Chaudhuri, A., Tonapi, S.

Year:

2003

Language:

english

File:

PDF, 388 KB

english, 2003

43

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of solder joint size on fatigue life of WL-CSP under accelerated thermal cycling using FEM

Bajad, Nupur, Kulkarni, Harshada, Dhole, Satish, Thakur, Shiwani, Tonapi, Sandeep

Year:

2014

Language:

english

File:

PDF, 992 KB

english, 2014

44

[IEEE 2002 Annual Reliability and Maintainability Symposium (RAMS) - Seattle, WA, USA (28-31 Jan. 2002)] Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) - Reliability of lead-free solder interconnects-a review

Tonapi, S., Gopakumar, S., Borgesen, P., Srihari, K.

Year:

2002

Language:

english

File:

PDF, 680 KB

english, 2002

45

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Comparison of the adhesion strength of epoxy and silicone based thermal interface materials

Prabhakumar, A., Zhong, A., Tonapi, S., Sherman, D., Cole, H., Schattenmann, F., Srihari, K.

Year:

2003

Language:

english

File:

PDF, 532 KB

english, 2003

46

Host plant resistance to grain mould in germplasm accessions of pearl millet ( Pennisetum glaucum [L.] R. Br.)

Navi, S. S., Tonapi, V. A., Varanavasiappan, S., Ravinderreddy, Ch.

Journal:

Archives of Phytopathology and Plant Protection

Year:

2006

Language:

english

File:

PDF, 268 KB

english, 2006

47

A study on the developmental bionomics of Dineutes indicus Aube (Gyrinidae, Coleoptera)

Mohan Rao, H.N., Tonapi, G.T.

Journal:

Journal of Natural History

Year:

1968

Language:

english

File:

PDF, 467 KB

english, 1968

48

[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Voids in thermal interface material layers and their effect on thermal performance

Gowda, A., Esler, D., Tonapi, S., Nagarkar, K., Srihari, K.

Year:

2004

Language:

english

File:

PDF, 380 KB

english, 2004

49

[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Assembly and reliability of flip chips with a nano-filled wafer level underfill

Prabhakumar, A., Campbell, J., Mills, R., Gillespie, P., Esler, D., Rubinsztajn, S., Sandeep Tonapi,, Krishnaswarmi Srihari,

Year:

2004

Language:

english

File:

PDF, 413 KB

english, 2004

50

Iterative germination and innovative techniques for the production and inoculation of secondary conidia of sorghum ergot ( Claviceps africana )

Tonapi, V. A., Ryley, M., Galea, V., Bhuiyan, S., Wearing, A

Journal:

Archives of Phytopathology and Plant Protection

Year:

2009

Language:

english

File:

PDF, 870 KB

english, 2009

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